EP3SE110F780I3 vs EP3SE110F780I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780I3 sa pamamagitan ng Intel at EP3SE110F780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780I3 | EP3SE110F780I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107500 | 107,500 |
| Number of LABs/CLBs | 4300 | — |
| Number of Logic Elements/Cells | 107500 | — |
| Total RAM Bits | 8936448 | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 1.1 V core | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FC-FBGA) |
| Temperature na Operasyon | -40C to +100C (industrial) | — |
| Packhaging / Kaso | 780-BBGA, FCBGA (FineLine BGA) | — |
| Supplier Device Package | 780-FBGA | — |
| Tindminan RoHS | unknown | Compliant (per legacy Altera data) |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | unknown | — |
| Grade | Industrial | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Core Voltage | — | 0.9 V |
| Packhaging | — | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |