EP3SE110F780I3 vs EP3SE110F780I4L 比較
詳細並排比較 EP3SE110F780I3 由 Intel 與 EP3SE110F780I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE110F780I3 | EP3SE110F780I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107500 | 107,500 |
| Number of LABs/CLBs | 4300 | — |
| Number of Logic Elements/Cells | 107500 | — |
| Total RAM Bits | 8936448 | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 1.1 V core | — |
| Process Technology | 65 nm | 65 nm CMOS |
| 安裝類型 | Surface Mount | Surface Mount (FC-FBGA) |
| 工作溫度 | -40C to +100C (industrial) | — |
| 封裝 / 外殼 | 780-BBGA, FCBGA (FineLine BGA) | — |
| Supplier Device Package | 780-FBGA | — |
| RoHS 狀態 | unknown | Compliant (per legacy Altera data) |
| 濕度敏感等級 (MSL) | unknown | — |
| Grade | Industrial | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Core Voltage | — | 0.9 V |
| 封裝 | — | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |