EP3SE110F780I4L vs EP3SE110F780C4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780I4L sa pamamagitan ng Intel at EP3SE110F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F780I4L EP3SE110F780C4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Family Stratix III E —
Logic Elements 107,500 —
LABs (Logic Array Blocks) 4,300 —
User I/Os 488 —
Embedded Memory 8,936,448 bits (8.9 Mbit) —
Maximum Operating Frequency 375 MHz —
Process Technology 65 nm CMOS 65 nm CMOS
Core Voltage 0.9 V —
Packhaging 780-pin FC-FBGA (Flip-Chip BGA) —
Package Body Size 29 mm × 29 mm —
Ball Pitch 1.0 mm 1.0 mm
Operating Temperature (Industrial) -40 °C to +100 °C —
Uri ng Pagpapasok Surface Mount (FC-FBGA) Surface Mount
Tindminan RoHS Compliant (per legacy Altera data) Compliant
Product Status Not Recommended for New Designs (NRND) —
Series — Stratix III E
Number of Logic Elements (LE) — 107,500
Number of Logic Array Blocks (LAB) — [DATA_NEEDED: number of LABs]
Total Memory Bits — 8,936,448 bits
Number of 18x18 Multipliers — 488
Number of PLLs — [DATA_NEEDED: PLL count]
User I/O Pins — 488
Speed Grade — -4 (commercial)
Process Variant — L (low-leakage)
Temperature na Operasyon — 0C to +85C (commercial)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
Package Type — 780-Ball FCBGA
Level ng MSL — 3 (per JEDEC J-STD-020)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita