EP3SE110F780I4N vs EP3SE50F780I3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780I4N sa pamamagitan ng Intel at EP3SE50F780I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F780I4N EP3SE50F780I3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Manufacturer Intel (formerly Altera) —
Series Stratix III E —
Logic Elements 107,500 —
Embedded Memory Bits 8,936,448 bits —
Number of LABs/CLBs 4300 —
Number of Logic Elements / Cells 107500 —
Number of I/O 488 —
Packhaging 780-ball FCBGA (FineLine BGA) 780-pin FC-FBGA (F780) 29x29 mm
Package Code (JEDEC) BGA, 780 pins —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Temperature na Operasyon -40C to +100C (industrial) -40C to +100C (Industrial, I3)
Speed Grade 4 3
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal] —
Process Node 40 nm —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Lead Free [DATA_NEEDED: lead-free status] —
Family — Stratix III E
Logic Elements (LE) — 47,500
Adaptive Logic Modules (ALM) — 19,000
Embedded Memory — 8.7 Mbits (M9K + M144K blocks)
DSP Blocks — 264 (18x18 multipliers)
Maximum User I/O Pins — 488
Transceivers — 12 channels, up to 3.75 Gbps
Core Voltage — 1.1 V
Process Technology — TSMC 40 nm
Memory Interfaces — DDR3 up to 800 MHz, DDR2, QDR II+ SRAM
PCI Express Hard IP — Gen1 x1/x4/x8
Level ng MSL — 3
Lead-Free — Yes

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