EP3SE260F1152C2N vs EP3SE260F1152C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2N sa pamamagitan ng Intel at EP3SE260F1152C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1152C2N | EP3SE260F1152C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | Stratix III E | Stratix III E |
| Family | FPGA - Field Programmable Gate Array | — |
| Number of Logic Elements | 255000 | — |
| Number of LABs/CLBs | 10200 | — |
| Total Memory Bits | 16672768 | — |
| Number of I/O | 744 | — |
| Voltage - Supply | 1.1 V | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature grade] | 0C to +85C (Commercial) |
| Packhaging / Kaso | 1152-BBGA, FCBGA | — |
| Process Technology | 65 nm | 40 nm |
| Maximum Frequency | 600 MHz | — |
| Supplier Device Package | 1152-FCBGA | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) | — |
| ECCN | [DATA_NEEDED: ECCN code] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 744 |
| Embedded 18x18 Multipliers | — | 384 |
| Packhaging | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | — | 0.9 V to 1.1 V |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |
| Speed Grade | — | C3 |