EP3SE260F1152C3N vs EP3SE110F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3N sa pamamagitan ng Intel at EP3SE110F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3N EP3SE110F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Series Stratix III E Stratix III
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 4,300
User I/O Count 744 —
Packhaging 1152-BBGA, FCBGA —
Uri ng Pagpapasok Surface Mount Surface Mount
Process Technology 65 nm 65 nm TSMC
Core Voltage 1.1 V —
Temperature na Operasyon 0 C to +85 C (Commercial) 0 °C to 85 °C (commercial)
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) Yes (embedded multipliers)
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II DDR/DDR2/DDR3 with read/write leveling
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
Tindminan RoHS Compliant —
Family — Stratix III E
Logic Elements (LE) — 107,500
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Speed Grade — C3
Style ng Pagpapasok — SMD/SMT (Tray)
Uri ng Memory — M9K and M144K block RAM
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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