EP3SE260F1152C3NES vs EP3SE260F1152C2G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3NES sa pamamagitan ng Altera at EP3SE260F1152C2G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera
EP3SE260F1152C3NES ⚠ Huling PagbiliAltera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoletePagsanggunian na paghahambing
| Parametro | EP3SE260F1152C3NES | EP3SE260F1152C2G |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Manufacturer | Altera (now Intel FPGA) | — |
| Series | Stratix III E | EP3SE260 |
| Family | Stratix III Enhanced | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Number of I/Os | 744 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.1 V | — |
| Number of 18x18 Multipliers | 768 | — |
| Number of PLLs | 12 | — |
| Package Type | 1152-ball FBGA (FineLine BGA) | — |
| Pin/Package Designator | F1152 | — |
| Speed Grade | -3 (faster) | C2 (commercial) |
| Hard Memory Controllers | 4 | — |
| Hard PCIe Blocks | 4 | — |
| External Memory Interface | DDR3, DDR2, DDR, QDRII+, RLDRAM2 | — |
| Operating Temperature Grade | Commercial | Commercial (C) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant (G suffix) |
| Lead-Free | Yes | — |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Packhaging | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Supply Packaging | — | Tray |