EP3SE260F1152I3 vs EP3SE260F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I3 sa pamamagitan ng Intel at EP3SE260F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152I3 EP3SE260F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Aktibo
Series Stratix III E (EP3SE260) Stratix III E
Logic Elements 255,000 —
Number of LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 —
User I/O Count 744 744
Number of Embedded Multipliers (DSP blocks) 768 —
Core Voltage 1.1 V 1.1 V
Temperature na Operasyon -40C to +100C (Industrial) 0 C to +85 C (Commercial)
Process Technology 65 nm 65 nm
Maximum Fabric Frequency 500 MHz —
Packhaging 1152-BBGA, FC-FBGA (Flip-Chip) 1152-BBGA, FCBGA
Uri ng Pagpapasok Surface Mount Surface Mount
Speed Grade I3 (Industrial, speed bin 3) —
Level ng MSL [DATA_NEEDED: MSL level] —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Product Status Obsolete (per Xecor comparator) —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

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