EP3SE260F1517C2 vs EP3SE260F1517C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2 sa pamamagitan ng Altera at EP3SE260F1517C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517C2 | EP3SE260F1517C3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix® III E | — |
| Logic Elements (LE) | 254,400 | — |
| Logic Array Blocks (LAB) | 10,200 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Total Memory Bits | 16,672,768 | — |
| Distributed RAM (Kb) | 4,608 | — |
| Embedded Block RAM (Kb) | 15,408 | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/O Pins | 976 | — |
| High-Speed Transceivers | 48 (up to 6.375 Gbps) | — |
| PLLs | 12 | 4 |
| Speed Grade | C2 | C3 (commercial) |
| Temperature Grade | Commercial (0C to +85C, suffix C2) | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Node | TSMC 40 nm | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Family | — | Stratix III E |
| Logic Elements | — | 254,400 |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| Global Clock Networks | — | 16 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| Temperature ng Junction na Operasyon | — | 0 C to +85 C (commercial) |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |