EP3SE260F1517C2G vs EP3SE260F1517C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2G sa pamamagitan ng Intel at EP3SE260F1517C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C2G | EP3SE260F1517C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | 255,000 |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| Packhaging | 1517-ball FCBGA, 40x40 mm | 1517-BBGA, FCBGA (FineLine BGA) |
| Speed Grade | C2 (commercial, ~6 ns) | 3 |
| Temperature na Operasyon | 0C to 85C (commercial, "C" suffix) | — |
| Process Node | 40 nm TSMC | 65 nm (TSMC) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| PLLs | — | 12 |
| Core Voltage | — | 0.9 V |
| Package Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Configuration | — | SRAM-based, requires external configuration device |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |