EP3SE260F1517C2N vs EP3SE260F1517C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C2N sa pamamagitan ng Intel at EP3SE260F1517C4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1517C2N EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel

EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel

EP3SE260F1517C2N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1517C2N EP3SE260F1517C4
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III E Stratix® III E FPGA
Logic Elements 255,000 —
Logic Array Blocks (LABs) 10,200 —
Total Memory Bits 16,672,768 —
Maximum User I/Os 976 —
Core Voltage 1.1 V —
Process Technology 65 nm —
Maximum Core Frequency 600 MHz —
Packhaging 1517-ball FC-BGA 1517-BBGA, FCBGA
Uri ng Pagpapasok Surface Mount Surface Mount
Operating Temperature Grade Commercial (0C to +85C) —
Configuration Interface Passive Serial, Fast Passive Parallel, JTAG, Active Serial —
Lead Free Yes —
Tindminan RoHS Compliant Compliant (per Altera product page)
Speed Grade C2 -4
Series — Stratix III E
Logic Elements (LE) — 255,000
Adaptive Logic Modules (ALM) — 10,200 LABs / 10200 ALMs (per Mouser listing)
Embedded Memory (bits) — 16,672,768
User I/O Count — 976
DSP Blocks — 768 (18x18 multipliers per Mouser listing)
Ball Count — 1517
Package Style — Flip-Chip BGA
Temperature na Operasyon — Commercial (0C to +85C) - inferred from C4 suffix
Process Node — 40 nm
Lead-Free — Yes

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