EP3SE260F1517C4LN vs EP3SE260F1517C2G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4LN sa pamamagitan ng Intel at EP3SE260F1517C2G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1517C4LN | EP3SE260F1517C2G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III E | — |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Number of LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 (16.67 Mbit) | 16,727,680 (16.67 Mbit) |
| Number of I/O | 976 | — |
| Number of Gates | [DATA_NEEDED: gate count not published in web data] | — |
| Voltage - Supply | 0.9 V to 1.1 V core | — |
| Operating Frequency | 375 MHz to 450 MHz (per family) | — |
| Process Technology | 65 nm | — |
| Packhaging / Kaso | 1517-BBGA, FCBGA (FC-FBGA) | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip) | — |
| Temperature na Operasyon | 0C to +85C (commercial grade per 'C' suffix) | 0C to 85C (commercial, "C" suffix) |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Speed Grade | C4 | C2 (commercial, ~6 ns) |
| Lead-Free / Halogen-Free | Yes (LN suffix) | Yes / Yes |
| Tindminan RoHS | Compliant | Compliant |
| Adaptive Logic Modules (ALMs) | — | 81,760 |
| Embedded Memory (M9K Blocks) | — | 864 |
| Embedded Multipliers (18x18) | — | 768 |
| User I/O Pins | — | 976 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 3.75 Gbps (C2 grade) |
| PLLs (Fractional + Clock Multiplier) | — | 8 fractional + 4 CMU |
| Global Clock Networks | — | 20 |
| Packhaging | — | 1517-ball FCBGA, 40x40 mm |
| Process Node | — | 40 nm TSMC |