EP3SE260F1517C4LN vs EP3SE260F1517C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4LN sa pamamagitan ng Intel at EP3SE260F1517C4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1517C4LN EP3SE260F1517C4
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Series Stratix III E Stratix III E
Family Stratix III E (Enhanced) Stratix® III E FPGA
Logic Elements 255,000 —
Number of LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 (16.67 Mbit) —
Number of I/O 976 —
Number of Gates [DATA_NEEDED: gate count not published in web data] —
Voltage - Supply 0.9 V to 1.1 V core —
Operating Frequency 375 MHz to 450 MHz (per family) —
Process Technology 65 nm —
Packhaging / Kaso 1517-BBGA, FCBGA (FC-FBGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount
Temperature na Operasyon 0C to +85C (commercial grade per 'C' suffix) Commercial (0C to +85C) - inferred from C4 suffix
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 Hours) —
Packaging Tray —
Speed Grade C4 -4
Lead-Free / Halogen-Free Yes (LN suffix) —
Tindminan RoHS Compliant Compliant (per Altera product page)
Logic Elements (LE) — 255,000
Adaptive Logic Modules (ALM) — 10,200 LABs / 10200 ALMs (per Mouser listing)
Embedded Memory (bits) — 16,672,768
User I/O Count — 976
DSP Blocks — 768 (18x18 multipliers per Mouser listing)
Packhaging — 1517-BBGA, FCBGA
Ball Count — 1517
Package Style — Flip-Chip BGA
Process Node — 40 nm
Lead-Free — Yes

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