EP3SE260F1517I3 vs EP3SE260F1517C2G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3 sa pamamagitan ng Intel at EP3SE260F1517C2G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1517I3 EP3SE260F1517C2G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Family Stratix III E Stratix III E
Logic Elements 255,000 254,400
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 —
Maximum User I/Os 976 —
Packhaging 1517-BBGA, FCBGA 1517-ball FCBGA, 40x40 mm
Uri ng Pagpapasok Surface Mount —
Operating Temperature Grade Industrial —
Junction Temperature Range -40C to +125C —
Core Voltage 1.0 V typical —
Process Technology 65 nm CMOS —
Maximum Core Frequency 717 MHz —
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL —
Tindminan RoHS Compliant Compliant
Configuration SRAM-based, volatile (requires external configuration device) —
Adaptive Logic Modules (ALMs) — 81,760
Total Memory Bits — 16,727,680 (16.67 Mbit)
Embedded Memory (M9K Blocks) — 864
Embedded Multipliers (18x18) — 768
User I/O Pins — 976
Transceiver Channels — 12
Transceiver Data Rate (max) — 3.75 Gbps (C2 grade)
PLLs (Fractional + Clock Multiplier) — 8 fractional + 4 CMU
Global Clock Networks — 20
Speed Grade — C2 (commercial, ~6 ns)
Temperature na Operasyon — 0C to 85C (commercial, "C" suffix)
Process Node — 40 nm TSMC
Lead-Free / Halogen-Free — Yes / Yes

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita