EP3SE260F1517I3 vs EP3SE260F1517C2G 比較

詳細並排比較 EP3SE260F1517I3 由 Intel 與 EP3SE260F1517C2G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260F1517I3 EP3SE260F1517C2G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 NRND
Family Stratix III E Stratix III E
Logic Elements 255,000 254,400
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 —
Maximum User I/Os 976 —
封裝 1517-BBGA, FCBGA 1517-ball FCBGA, 40x40 mm
安裝類型 Surface Mount —
Operating Temperature Grade Industrial —
Junction Temperature Range -40C to +125C —
Core Voltage 1.0 V typical —
Process Technology 65 nm CMOS —
Maximum Core Frequency 717 MHz —
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL —
RoHS 狀態 Compliant Compliant
Configuration SRAM-based, volatile (requires external configuration device) —
Adaptive Logic Modules (ALMs) — 81,760
Total Memory Bits — 16,727,680 (16.67 Mbit)
Embedded Memory (M9K Blocks) — 864
Embedded Multipliers (18x18) — 768
User I/O Pins — 976
Transceiver Channels — 12
Transceiver Data Rate (max) — 3.75 Gbps (C2 grade)
PLLs (Fractional + Clock Multiplier) — 8 fractional + 4 CMU
Global Clock Networks — 20
Speed Grade — C2 (commercial, ~6 ns)
工作溫度 — 0C to 85C (commercial, "C" suffix)
Process Node — 40 nm TSMC
Lead-Free / Halogen-Free — Yes / Yes

資料表與資源

瀏覽所有產品 建立 BOM 索取報價