EP3SE260H780C3N vs EP3SE260H780C2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3N sa pamamagitan ng Intel at EP3SE260H780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260H780C3N EP3SE260H780C2N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Series Stratix® III E Stratix III E
Logic Elements (LE) 255,000 —
Embedded Memory (bits) 16,672,768 —
Number of LABs/CLBs 10,200 —
User I/Os 488 —
Number of Pins / Balls 780 —
Packhaging 780-BBGA, FCBGA (H780) 780-BGA FCBGA
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon 0 °C to +85 °C (C grade, commercial) —
Process Technology 40 nm CMOS —
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] —
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] —
Tindminan RoHS Compliant (lead-free 'N' suffix) [DATA_NEEDED: rohs status]
Level ng Sensitivity sa Asid ng Moisture (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel —
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime —
Logic Elements — 255,000
LABs / CLBs — 10,200
Total RAM Bits — 16,672,768
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
Core Voltage — 0.9 V
Hanay ng Temperature na Operasyon — Commercial (0C to +85C)
Speed Grade — C2
Level ng MSL — 3 (168 hours)
Reflow Peak Time Max — 40 s
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

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