EP3SE50F484C2 vs EP3SE50F484C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C2 sa pamamagitan ng Intel at EP3SE50F484C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F484C2 EP3SE50F484C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III Enhanced (Stratix III E) Stratix III E
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory (M9K + MLAB) 5,760,000 bits —
User I/O Pins 296 296
Maksimum na Taktiko ng Oras 600 MHz —
Process Technology 65 nm —
Core Supply Voltage 1.1 V —
Packhaging 484-ball FC-FBGA (FCBGA) 484-ball FCBGA (F484), 1.0 mm pitch
Speed Grade C2 (commercial, fast) C3
Temperature na Operasyon [DATA_NEEDED: full temp range for C2 suffix] 0C to +85C (commercial, "C")
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Pitch [DATA_NEEDED: ball pitch of FC-FBGA-484] —
Configuration Interface JTAG / Active Serial (AS) —
DSP Blocks 18x18 dedicated multipliers —
Tindminan RoHS Compliant Compliant (lead-free)
Level ng MSL [DATA_NEEDED: MSL rating] —
Logic Elements — 47,500
Adaptive Logic Modules (ALMs) — 19,000
Total Embedded Memory — 5,760,000 bits (5.76 Mbit)
M9K Memory Blocks — 320 (2,304 Kbits)
M144K Memory Blocks — 12 (1,728 Kbits)
18x18 Multipliers — 384
PLLs — 4
Global Clock Networks — 16
Process Node — 65 nm TSMC low-power
Core Voltage — 1.1 V

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