EP3SE50F780C3G vs EP3SE50F780C4G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C3G sa pamamagitan ng Altera at EP3SE50F780C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F780C3G EP3SE50F780C4G
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Stratix III E Stratix III
Manufacturer Altera (now Intel) —
Family Stratix III E enhanced FPGA Stratix III E
Number of Logic Elements (LE) 47,500 LE —
Number of Adaptive Logic Modules (ALM) 19,000 ALM —
Embedded Memory 5.49 Mbit (5,760,000 bit) 5.76 Mbit (5760000 bit)
Number of User I/O 488 —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Core Supply Voltage 1.1 V 1.1 V
Temperature na Operasyon 0C to +85C (Commercial) —
Speed Grade C3 —
Packhaging / Kaso 780-BBGA, FCBGA (Flip-Chip) —
Style ng Pagpapasok SMD/SMT —
Packaging Tray —
Tindminan RoHS Compliant Compliant
Katayuan ng Lifecycle Not Recommended for New Designs (NRND) —
Configuration Memory External (EPCS / flash) SRAM-based (volatile, requires configuration device)
Logic Elements — 47,500 LE
Adaptive Logic Modules (ALMs) — 19,000 ALM
Number of I/Os — 488
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count from datasheet]
Number of Multipliers (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Process Technology — 40 nm TSMC
Hanay ng Temperature na Operasyon — 0 C to +85 C (commercial)
Packhaging — 780-ball FBGA (FCBGA)
Uri ng Pagpapasok — Surface Mount (SMD/SMT)
Lead-Free — Yes
Level ng MSL — MSL3 (per JEDEC J-STD-020)
Design Software — Quartus II

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