EP3SE50F780C4G vs EP3SE110F780C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C4G sa pamamagitan ng Intel at EP3SE110F780C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3SE50F780C4G | EP3SE110F780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix III E | Stratix III E |
| Series | Stratix III | — |
| Logic Elements | 47,500 LE | 107,500 |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.76 Mbit (5760000 bit) | 8,936,448 bits (8.9 Mbit) |
| Number of I/Os | 488 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count from datasheet] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Process Technology | 40 nm TSMC | — |
| Core Supply Voltage | 1.1 V | — |
| Hanay ng Temperature na Operasyon | 0 C to +85 C (commercial) | — |
| Packhaging | 780-ball FBGA (FCBGA) | 780-ball FCBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (SMD/SMT) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Design Software | Quartus II | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| DSP Blocks (18x18 Multipliers) | — | 896 |
| Maximum User I/O | — | 488 |
| Speed Grade | — | C4 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | Up to 1.6 Gbps |
| Memory Interface Support | — | DDR3 up to 800 MHz |
| Temperature na Operasyon | — | Commercial (0C to +85C) |
| Configuration | — | Partial Reconfiguration support |