EP3SE50F780C4G vs EP3SE110F780C4 比較
詳細並排比較 EP3SE50F780C4G 由 Intel 與 EP3SE110F780C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE50F780C4G | EP3SE110F780C4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Stratix III E | Stratix III E |
| Series | Stratix III | — |
| Logic Elements | 47,500 LE | 107,500 |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.76 Mbit (5760000 bit) | 8,936,448 bits (8.9 Mbit) |
| Number of I/Os | 488 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count from datasheet] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Process Technology | 40 nm TSMC | — |
| Core Supply Voltage | 1.1 V | — |
| 工作溫度範圍 | 0 C to +85 C (commercial) | — |
| 封裝 | 780-ball FBGA (FCBGA) | 780-ball FCBGA (FineLine BGA) |
| 安裝類型 | Surface Mount (SMD/SMT) | Surface Mount |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL 等級 | MSL3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Design Software | Quartus II | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| DSP Blocks (18x18 Multipliers) | — | 896 |
| Maximum User I/O | — | 488 |
| Speed Grade | — | C4 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | Up to 1.6 Gbps |
| Memory Interface Support | — | DDR3 up to 800 MHz |
| 工作溫度 | — | Commercial (0C to +85C) |
| Configuration | — | Partial Reconfiguration support |