EP3SE50F780I3N vs EP3SE50F780I3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780I3N sa pamamagitan ng Intel at EP3SE50F780I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F780I3N EP3SE50F780I3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Manufacturer Intel (formerly Altera) —
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Embedded Memory Bits 5,760,000 bits —
User I/O Pins 488 —
Packhaging 780-ball FC-FBGA (Fine-pitch Chip-Scale BGA) 780-pin FC-FBGA (F780) 29x29 mm
Process Technology 65 nm TSMC 40 nm
Core Voltage 0.9 V 1.1 V
Operating Temperature Grade Industrial —
Configuration Interface JTAG IEEE Std. 1149.1 (BST), Passive Serial, Fast Passive Parallel, Active Serial —
Boundary-Scan Support Yes (IEEE 1149.1) —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Tindminan RoHS Compliant Compliant
Katayuan ng Lifecycle Last Time Buy (Stratix III family EOL announced) —
Supply Type Tray (per JAK Electronics listing) —
Logic Elements (LE) — 47,500
Adaptive Logic Modules (ALM) — 19,000
Embedded Memory — 8.7 Mbits (M9K + M144K blocks)
DSP Blocks — 264 (18x18 multipliers)
Maximum User I/O Pins — 488
Transceivers — 12 channels, up to 3.75 Gbps
Temperature na Operasyon — -40C to +100C (Industrial, I3)
Speed Grade — 3
Memory Interfaces — DDR3 up to 800 MHz, DDR2, QDR II+ SRAM
PCI Express Hard IP — Gen1 x1/x4/x8
Level ng MSL — 3
Lead-Free — Yes

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