EP3SE80F1152C2 vs EP3SE260F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C2 sa pamamagitan ng Intel at EP3SE260F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE80F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | 744 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V | 1.1 V |
| Internal Operating Frequency | up to 600 MHz | — |
| Temperature na Operasyon | 0 C to 85 C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Speed Grade | C2 | C2 (commercial) |
| Packhaging | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |