EP3SL200H780I4 vs EP3SL200H780C4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4 sa pamamagitan ng Intel at EP3SL200H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL200H780I4 EP3SL200H780C4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Stratix III L Stratix III
Family Stratix III —
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 —
Embedded Memory Bits 10,901,504 —
User I/O Count 488 488
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS TSMC 40 nm
Package Type 780-BBGA / FCBGA (FC-HFBGA) 780-ball FCBGA (FineLine BGA, HBGA)
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) -4 (medium performance, commercial)
Temperature ng Junction na Operasyon -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
Tindminan RoHS Compliant Compliant
Design Tool Quartus II (legacy) / Quartus Prime —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA - Field Programmable Gate Array
Logic Elements — 200,000
Embedded Memory — 6.5 Mbit
Package Code — BGA-780 / PBGA780 / HBGA-780
Package Mounting — Surface Mount
Internal Logic Frequency — up to 717 MHz (per ampheo datasheet brief)
Temperature na Operasyon — 0C to 85C (commercial)
Lead-Free / Pb-Free — Yes (L suffix, lead-free)
Configuration Modes — FPP, AS, PS, JTAG

Mga Datasheets at Resources

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