EP3SL200H780I4N vs EP3SL200H780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4N sa pamamagitan ng Intel at EP3SL200H780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel
EP3SL200H780I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL200H780I4N | EP3SL200H780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III L | — |
| Family | Stratix III (Logic-rich variant) | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Logic Array Blocks (LABs) | 8,000 | 8,000 |
| Embedded Memory (bits) | 10,901,504 | — |
| User I/Os | 488 | 488 |
| Core Voltage | 1.1 V (0.86 V to 1.15 V range) | — |
| Process Technology | 65 nm CMOS | — |
| Fabric Frequency (typical) | 450 MHz | — |
| Speed Grade | I4 | C3 (commercial, -3 speed) |
| Hanay ng Temperature na Operasyon | -40C to +100C (industrial) | — |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA, FineLine) | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes (suffix N) | — |
| Tindminan RoHS | Compliant | — |
| Process Node | — | 40 nm |
| Embedded Memory Bits | — | 10,901,504 bits |
| Maximum Internal Clock Frequency | — | 800 MHz |
| Transceivers | — | 24 channels, up to 3.75 Gbps |
| DSP Blocks | — | 384 |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| Level ng MSL | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |