EP3SL50F484I3 vs EP3SL50F484I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F484I3 sa pamamagitan ng Intel at EP3SL50F484I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F484I3 | EP3SL50F484I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III L (Low Power) | Stratix III L |
| Device Logic Elements | 47,500 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Maximum User I/O | 296 | 296 |
| Packhaging | 484-ball FC-FBGA (Flip-Chip FineLine BGA) | 484-ball FBGA (FC-FBGA, 23x23 mm, 1.0 mm pitch) |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Internal Operating Frequency | 500 MHz | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMT) |
| Lead-Free / RoHS | [DATA_NEEDED: lead-free/RoHS status] | Lead Free / Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Configuration Scheme | SRAM-based (volatile, requires external config device) | — |
| Transceivers | Stratix III L — supports high-speed serial transceivers per family datasheet | — |
| Logic Elements | — | 47,500 |
| Embedded Memory | — | 2,184,192 bits (2.1 Mbit) |
| Embedded 18x18 Multipliers | — | 218 |
| Maximum Core Frequency | — | 500 MHz |
| Temperature ng Junction na Operasyon | — | -40C to +100C (Industrial) |
| Programming Tool | — | Quartus II (legacy) |