EP3SL50F780C2 vs EP3SL50F780I4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C2 sa pamamagitan ng Intel at EP3SL50F780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780C2 EP3SL50F780I4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Family Stratix III L —
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory (bits) 2,184,192 —
Maximum User I/Os 488 —
Core Voltage 1.1 V 0.9 V
Process Technology 65 nm —
Packhaging 780-ball FCBGA (Flip-Chip BGA) 780-BBGA, FCBGA
Temperature na Operasyon 0°C to +85°C (commercial) -40C to +100C (Industrial)
Maximum Core Frequency 600 MHz —
Configuration Interface JTAG / passive serial / fast passive parallel —
I/O Standards LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces —
Embedded Memory Type TriMatrix (MLAB, M9K, M144K blocks) —
Tindminan RoHS Compliant Compliant
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Series — Stratix III L
Manufacturer — Intel (formerly Altera)
Process Node — 40 nm TSMC
Logic Elements — 47,500
Embedded Memory Bits — 2,184,192
Embedded Memory Blocks — M20K blocks
DSP 18x18 Multipliers — 244
User I/Os — 488
PLLs — 8
Global Clock Networks — 28
Speed Grade — I4 (fastest)
Configuration Method — Serial, parallel, or JTAG
Memory Interfaces — DDR3, QDRII+, RLDRAM II
Hard IP — PCIe Gen2 hard IP blocks

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