EP3SL70F484I3G vs EP3SL70F484I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484I3G sa pamamagitan ng Altera at EP3SL70F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F484I3G EP3SL70F484I3
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Series Stratix III L —
Family Stratix III (low-power variant) Stratix III L
Logic Elements (LE) 67,500 —
ALMs (Adaptive Logic Modules) [DATA_NEEDED: ALM count] —
Total Memory Bits 2,699,264 —
DSP Blocks [DATA_NEEDED: DSP block count] —
User I/O Pins 296 296
Transceivers 24 Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package]
Maximum Transceiver Data Rate [DATA_NEEDED: max transceiver Gbps] —
Package Type 484-ball FCBGA (Fine-pitch Chip-Scale BGA) —
Package Pin Count 484 —
Speed Grade I3 -3 (mid-tier)
Hanay ng Temperature na Operasyon -40C to +100C (Industrial) —
Core Voltage 1.0 V —
Process Technology 40 nm TSMC —
Uri ng Pagpapasok Surface Mount —
Level ng MSL [DATA_NEEDED: MSL level] —
Tindminan RoHS Compliant Compliant
Configuration Interface JTAG / Serial Passive / Active Serial —
Logic Elements — 67,500
Adaptive Logic Modules (ALMs) — 33,000
Logic Array Blocks (LABs) — 2,700
Total Embedded Memory — 2,699,264 bits (337 KB)
M9K Memory Blocks — 288
M144K Memory Blocks — 12
DSP Blocks (18x18 multipliers) — 384
PLLs — 8 (4 enhanced PLLs + 4 fast PLLs)
Process Node — TSMC 40 nm
Temperature na Operasyon — -40C to +100C (industrial)
Packhaging — 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch
Configuration Modes — FPP, AS, PS, JTAG, AES encryption
Design Software — Quartus II (legacy)

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