EP3SL70F484I3N vs EP3SL70F484I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484I3N sa pamamagitan ng Intel at EP3SL70F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F484I3N | EP3SL70F484I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | Stratix III L | — |
| Logic Elements / Cells | 67,500 | — |
| Number of LABs / CLBs | 2,700 | — |
| Total RAM Bits | 2,699,264 | — |
| Number of I/O | 296 | — |
| Packhaging / Kaso | 484-BBGA, FCBGA | — |
| Supplier Device Package | 484-FBGA (23x23 mm) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | -40C to +100C (TJ) | -40C to +100C (industrial) |
| Voltage - Supply | [DATA_NEEDED: core and I/O supply voltages] | — |
| Process Technology | 40 nm CMOS | — |
| DSP Blocks | [DATA_NEEDED: exact count for EP3SL70] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count for this speed grade] | — |
| Product Status | Obsolete (per Assypcb listing) | — |
| Tindminan RoHS | [DATA_NEEDED: per datasheet] | Compliant |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | [DATA_NEEDED: MSL rating] | — |
| Speed Grade | 3 | -3 (mid-tier) |
| Temperature Grade | Industrial (I) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,000 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Total Embedded Memory | — | 2,699,264 bits (337 KB) |
| M9K Memory Blocks | — | 288 |
| M144K Memory Blocks | — | 12 |
| DSP Blocks (18x18 multipliers) | — | 384 |
| User I/O Pins | — | 296 |
| Transceivers | — | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] |
| PLLs | — | 8 (4 enhanced PLLs + 4 fast PLLs) |
| Process Node | — | TSMC 40 nm |
| Packhaging | — | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch |
| Configuration Modes | — | FPP, AS, PS, JTAG, AES encryption |
| Design Software | — | Quartus II (legacy) |