EP3SL70F780C4L vs EP3SL70F780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780C4L sa pamamagitan ng Intel at EP3SL70F780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780C4L | EP3SL70F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | — |
| Temperature na Operasyon | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | 780-ball FC-FBGA (29x29 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Logic Elements | — | 67,500 |
| Adaptive Logic Modules (ALMs) | — | 33,750 |
| Embedded Memory Bits | — | 2,699,264 bits (2.699 Mbit) |
| Embedded Multipliers (18x18) | — | 488 |
| Maximum Operating Frequency | — | 717 MHz |
| Core Voltage | — | 1.1 V |
| Number of I/O Banks | — | 8 |
| Bilang ng Pins | — | 780 |
| Hanay ng Temperature na Operasyon | — | Commercial (0C to +85C) |
| Tindminan RoHS | — | Compliant (lead-free FBGA) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |