EP4CE55F29C9LN vs EP4CE55F29I8LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29C9LN sa pamamagitan ng Intel at EP4CE55F29I8LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29C9LN | EP4CE55F29I8LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits | — |
| Embedded 18x18 Multipliers | 374 | — |
| Logic Array Blocks (LAB) | 3,491 | — |
| M9K Memory Blocks | 260 | — |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 374 | 374 |
| Technology Node | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Temperature ng Junction na Operasyon | 0 °C to 85 °C (commercial) | — |
| Packhaging | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | Yes (Pb-free terminal finish, suffix 'N') | Yes (per OPN suffix N) |
| Speed Grade | C9 | — |
| Device Model | — | EP4CE55 |
| Logic Elements (LEs) | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3,135 |
| Total Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks |
| 18x18 Hardware Multipliers | — | 374 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm TSMC low-power |
| Ball Pitch | — | 1.0 mm |
| Temperature na Operasyon | — | -40C to +85C (Industrial) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |