EP4CE55F29I7N vs EP4CE55F29I8L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29I7N sa pamamagitan ng Intel at EP4CE55F29I8L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29I7N | EP4CE55F29I8L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | 2,396,160 bits |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | — |
| Packhaging | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-FBGA (FineLine BGA), 29x29 mm |
| Speed Grade | I7 (industrial) | 8 |
| Temperature ng Junction na Operasyon | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | 60 nm low-power |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Supply Type | Tray | — |
| Device Logic Elements | — | 55,856 |
| Embedded 18x18 Multipliers | — | 156 |
| Maximum User I/Os | — | 374 |
| PLLs | — | 4 |
| Logic Array Blocks (LABs) | — | 3,435 |
| Core Voltage VCCINT | — | 1.0 V / 1.2 V |
| Auxiliary Voltage VCCAUX | — | 2.5 V |
| I/O Voltage VCCIO | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Operating Temperature (Industrial) | — | -40C to +100C junction |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |