EP4CE6E22C8L vs EP4CE6E22C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22C8L sa pamamagitan ng Intel at EP4CE6E22C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE6E22C8L | EP4CE6E22C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | — |
| Embedded Memory (Bits) | 276,480 | — |
| Embedded Memory Blocks (M9K) | 30 | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| General-purpose PLLs | 2 | — |
| User I/O Count | 91 | — |
| User I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 60 nm (low-power) | TSMC 60 nm low-k |
| Packhaging | 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch | — |
| Hanay ng Temperature na Operasyon | -40 C to +85 C (Industrial, 'L' suffix) | — |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Active Serial (EPCS) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Temperature na Operasyon | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |