EP4CE6E22C9L vs EP4CE6E22C9LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22C9L sa pamamagitan ng Intel at EP4CE6E22C9LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE6E22C9L | EP4CE6E22C9LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV E | Cyclone® IV E |
| Logic Elements (LE) | 6,272 | 6,272 |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | — |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | 91 |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Packhaging | 144-LQFP Exposed Pad (EQFP-144) | 144-pin EQFP (EQFP-144, 22x22 mm, 0.5 mm pitch) |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature grade] |
| Speed Grade | C9 | — |
| Tindminan RoHS | Compliant | Compliant (LEAD FREE per FindIC) |
| Device Family | — | EP4CE6 (Cyclone IV E) |
| Configurable Logic Blocks (CLB / LAB) | — | 392 |
| Embedded Memory (Total) | — | 276,480 bits |
| Distributed RAM | — | 270 Kbits |
| Block RAM (M9K) | — | 30 Kbits (M9K blocks) |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm |
| Package Style | — | Exposed Pad, GULL WING leads (HLFQFP) |