EP4CE6F17C6 vs EP4CE6F17C8 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6F17C6 sa pamamagitan ng Intel at EP4CE6F17C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CE6F17C6 EP4CE6F17C8
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV E —
Logic Elements (LE) 6,272 —
Configurable Logic Blocks (CLB) 392 —
Embedded Memory 276,480 bits —
Embedded 18x18 Multipliers 15 —
PLLs 2 2
Maximum User I/O 179 —
Packhaging 256-FBGA 17x17 mm, 1.0 mm pitch 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm
Speed Grade C6 (commercial) C8
Temperature ng Junction na Operasyon 0°C to 85°C —
Core Voltage VCCINT 1.2 V (typical) —
Process Node 60 nm low-power —
I/O Banks 8 —
Memory Blocks M9K (30 blocks) —
Configuration Mode Active Serial (AS), Passive Serial (PS), JTAG —
Tindminan RoHS Compliant Compliant
Uri ng Pagpapasok Surface Mount (FBGA) —
Level ng MSL 3 (168 hours) —
Device Family — Cyclone IV E
Logic Elements (LEs) — 6,272
Logic Array Blocks (LABs) — 392
Embedded Memory Bits — 276,480
M9K Memory Blocks — 30
Embedded 18 x 18 Multipliers — 15
Global Clock Networks — 10
Maximum User I/Os — 179
Process Technology — 60 nm low-power SRAM
Core Supply Voltage — 1.0 V to 1.2 V
Temperature na Operasyon — 0 C to 85 C (commercial, C8 speed grade)
Configuration Modes — JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP)
I/O Standards Supported — LVTTL, LVCMOS, LVDS, SSTL, HSTL

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