EP4CE6F17C8 vs EP4CE6F17C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6F17C8 sa pamamagitan ng Intel at EP4CE6F17C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE6F17C8 | EP4CE6F17C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Cyclone IV E | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | 392 | — |
| Embedded Memory Bits | 276,480 | — |
| M9K Memory Blocks | 30 | — |
| Embedded 18 x 18 Multipliers | 15 | — |
| PLLs | 2 | 2 |
| Global Clock Networks | 10 | — |
| Maximum User I/Os | 179 | — |
| Packhaging | 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm | 256-FBGA 17x17 mm, 1.0 mm pitch |
| Process Technology | 60 nm low-power SRAM | — |
| Core Supply Voltage | 1.0 V to 1.2 V | — |
| Temperature na Operasyon | 0 C to 85 C (commercial, C8 speed grade) | — |
| Speed Grade | C8 | C6 (commercial) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 6,272 |
| Configurable Logic Blocks (CLB) | — | 392 |
| Embedded Memory | — | 276,480 bits |
| Embedded 18x18 Multipliers | — | 15 |
| Maximum User I/O | — | 179 |
| Temperature ng Junction na Operasyon | — | 0°C to 85°C |
| Core Voltage VCCINT | — | 1.2 V (typical) |
| Process Node | — | 60 nm low-power |
| I/O Banks | — | 8 |
| Memory Blocks | — | M9K (30 blocks) |
| Configuration Mode | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Uri ng Pagpapasok | — | Surface Mount (FBGA) |
| Level ng MSL | — | 3 (168 hours) |