EP4CGX110DF31I6N vs EP4CGX110DF31I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF31I6N sa pamamagitan ng Intel at EP4CGX110DF31I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CGX110DF31I6N EP4CGX110DF31I7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone IV GX —
Logic Elements 109,424 —
Embedded Memory Bits 5,621,760 —
Maximum User I/Os 475 —
Embedded 18x18 Multipliers 66 —
Transceiver Channels 8 (max) —
Max Transceiver Data Rate 3.125 Gbps —
General-purpose PLLs 4 —
Global Clock Networks 20 —
Core Voltage 1.2 V 1.2 V typical
Process Technology 60 nm —
Packhaging 896-BGA (FineLine BGA) 896-BGA (FBGA-896), 31 mm
Temperature na Operasyon -40C to +100C (Industrial) —
Configuration SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG —
Hard PCIe Gen1 IP Yes (x1/x4) —
Tindminan RoHS Compliant Compliant
Level ng MSL 3 (per JEDEC J-STD-020) 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days]
Series — Cyclone IV GX
Device Logic Elements — 109,424
Total Memory Bits — 5,621,760
Number of Logic Array Blocks (LABs) — Not specified in provided data [DATA_NEEDED: LAB count]
Number of I/O — 475 user I/O
Multipliers (18x18) — 432
PLLs — 4
Transceivers — 8 (up to 3.125 Gbps)
M9K Memory Blocks — 270
Ball Pitch — 0.8 mm
Speed Grade — -7
Temperature Grade — Industrial (-40C to +100C Tj)
Configuration Method — SRAM (EPCS or JTAG)
Uri ng Pagpapasok — Surface Mount

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita