EP4CGX50CF23C6N vs EP4CGX50DF23C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50CF23C6N sa pamamagitan ng Intel at EP4CGX50DF23C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50CF23C6N | EP4CGX50DF23C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX50 | — |
| Logic Elements (LE) | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks (M9K) | 56 | — |
| Embedded 18x18 Multipliers | 132 | 66 |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 11 | 8 (with up to 16 clock pins per region) |
| Maximum User I/O | 290 | — |
| Transceivers | Up to 8 channels at 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Packhaging | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 | — |
| Tindminan RoHS | Compliant | Compliant (Pb-free variant) |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 49,888 |
| Total RAM Bits | — | 2,432 Kbit (≈ 304 KB) |
| PLLs | — | 2 |
| Number of I/O Pins | — | 290 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Supported Memory Interfaces | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| Level ng MSL | — | 3 (168 hours) |