EP4CGX50CF23C7N vs EP4CGX50CF23C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50CF23C7N sa pamamagitan ng Intel at EP4CGX50CF23C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50CF23C7N | EP4CGX50CF23C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Packhaging | 484-FBGA (F23, 23 x 23 mm) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | C7 (commercial) | 8 |
| Temperature na Operasyon | -40C to +85C (commercial) | — |
| Process Technology | 60 nm TSMC low-power | 60 nm |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | — |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Device Logic Elements | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Embedded Memory (bits) | — | 2,562,048 |
| User I/O Pins | — | 290 |
| Transceivers | — | Up to 8 x 3.125 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| PLLs | — | 4 |
| Operating Temperature Grade | — | Commercial (C) |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |