EP4CGX50DF23C7N vs EP4CGX50CF23C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF23C7N sa pamamagitan ng Intel at EP4CGX50CF23C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50DF23C7N | EP4CGX50CF23C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | — |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Integrated (Cyclone IV GX) |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | — |
| Packhaging | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-FBGA (F23) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FBGA) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| Tindminan RoHS | Compliant (Pb-free variant) | Compliant |
| Level ng MSL | 3 (168 hours) | — |
| Logic Cells | — | 49,888 |
| Embedded Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks | — | M9K blocks, 9 Kbit each |
| Maximum User I/O | — | 290 |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.2 V |
| Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | C7 |
| DSP Blocks | — | 18x18 hardware multipliers |