EP4CGX50DF23C7N vs EP4CGX50CF23C7 比較
詳細並排比較 EP4CGX50DF23C7N 由 Intel 與 EP4CGX50CF23C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CGX50DF23C7N | EP4CGX50CF23C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | — |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Integrated (Cyclone IV GX) |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| 工作溫度 | 0 °C to 85 °C (commercial) | — |
| 封裝 | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-FBGA (F23) |
| 安裝類型 | Surface Mount | Surface Mount (FBGA) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| RoHS 狀態 | Compliant (Pb-free variant) | Compliant |
| MSL 等級 | 3 (168 hours) | — |
| Logic Cells | — | 49,888 |
| Embedded Memory Bits | — | 2,562,048 bits |
| Embedded Memory Blocks | — | M9K blocks, 9 Kbit each |
| Maximum User I/O | — | 290 |
| Ball Pitch | — | 1.0 mm |
| Core Voltage | — | 1.2 V |
| Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | C7 |
| DSP Blocks | — | 18x18 hardware multipliers |