EP4CGX75DF27C6 vs EP4CGX75DF27C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75DF27C6 sa pamamagitan ng Intel at EP4CGX75DF27C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX75DF27C6 | EP4CGX75DF27C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | — |
| Device Logic Elements | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| Maximum User I/O | 310 | — |
| Process Technology | 60 nm CMOS | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Packhaging | 672-ball FBGA | 672-ball FBGA (F27) |
| Package Code | F27 (672-FBGA) | — |
| Transceivers | Integrated (3.125 Gbps) | — |
| Embedded Multipliers (18x18) | 274 | — |
| PLLs | Yes (periphery and global) | 4 |
| PCIe Hard IP | Yes (Gen1) | PCIe Gen1 x1/x2/x4 endpoint |
| Configuration Modes | JTAG, Active Serial, Passive Serial | — |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | 6 | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 73,920 |
| Logic Array Blocks (LAB) | — | 4,605 |
| Embedded Memory | — | 4,257,792 bits (approx. 532 Kbits RAM) |
| Embedded 18x18 Multipliers | — | 274 |
| User I/O Pins | — | 310 |
| High-Speed Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Method | — | SRAM-based, requires external config device |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED: halogen free status] |