EP4SGX360FH29C4 vs EP4SGX360FH29C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FH29C4 sa pamamagitan ng Intel at EP4SGX360FH29C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360FH29C3N - Stratix IV GX FPGA, 353.6K LE, 780-FBGA | Intel
EP4SGX360FH29C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360FH29C4 | EP4SGX360FH29C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix IV GX | — |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | 289 |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Temperature na Operasyon | 0 C to +85 C (commercial, C4 grade) | [DATA_NEEDED: operating temperature range] |
| Packhaging | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 780-FBGA, FC-HFBGA |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| Number of LABs/CLBs | — | 14,144 |
| Total RAM Bits | — | 23,105,536 |
| Process Technology | — | 40 nm |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| PCI Express Support | — | Gen1 / Gen2 hard IP |
| Speed Grade | — | C3 |
| Design Tool | — | Quartus II |