EP4SGX360HF35C3 vs EP4SGX360HF35C2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360HF35C3 sa pamamagitan ng Intel at EP4SGX360HF35C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX360HF35C3 EP4SGX360HF35C2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Stratix IV GX Stratix IV GX
Manufacturer Intel (formerly Altera) —
Logic Elements 353,600 —
Total Memory Bits 23,105,536 (22.5 Mbit) —
Number of LABs 14,144 —
User I/O Count 564 —
Packhaging 1152-BBGA, FCBGA (FineLine BGA) —
Uri ng Pagpapasok Surface Mount Surface Mount (Flip-Chip BGA)
Process Node 40 nm —
Supply Voltage - Core [DATA_NEEDED: core voltage] —
Temperature na Operasyon Commercial (0C to +85C) - inferred from C3 suffix 0C to +85C (commercial)
Transceivers Multi-gigabit serial transceivers integrated Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable)
DSP Blocks Variable-precision DSP blocks —
Memory Controllers Hard memory controller blocks —
PCI Express Hard IP Yes (PCIe Gen2 capable per family) —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Development Tool Quartus II Design Software (v13.0 or later) —
Family — Stratix IV GX FPGA
Logic Elements (LEs) — 353,600
LABs/CLBs — 14,144
Number of I/O — 564 (max 532 user I/O)
Embedded Memory (bits) — 23,105,536
Number of Logic Cells — 353,600
Core Voltage — 0.9 V
Process Technology — 40 nm
Package Type — 1152-pin FC-FBGA
Package Code — HF35 (35x35 mm, 1.0 mm pitch)
Configuration — JTAG / Active Serial (external config device)
Design Tool — Quartus II / Quartus Prime

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