EP4SGX360KF40C2 vs EP4SGX360FH29C2X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360KF40C2 sa pamamagitan ng Intel at EP4SGX360FH29C2X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX360FH29C2X - 353600 LEs Stratix IV GX FPGA, 780-HBGA | Intel
EP4SGX360FH29C2X ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX360KF40C2 | EP4SGX360FH29C2X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix IV GX | — |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | C2 (commercial) | C2 |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Packhaging | 1517-ball FCBGA, 42.5 x 42.5 mm | 780-BBGA, FCBGA (33x33 mm) |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Level ng MSL | MSL3 (per JEDEC J-STD-020) | 3 |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Stratix IV GX |
| Logic Elements | — | 353600 |
| LABs/CLBs | — | 14144 |
| Total RAM Bits | — | 23105536 |
| Number of I/O | — | 289 |
| Number of Transceivers | — | 24 |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Core Voltage Supply | — | 0.87 V to 0.93 V |
| Operating Temperature Grade | — | Commercial |