EPF10K100EFC256-3 vs EPF10K100BFC256-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EFC256-3 sa pamamagitan ng Intel at EPF10K100BFC256-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K100EFC256-3 EPF10K100BFC256-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE FLEX 10KE
Logic Elements 4,992 —
System Gates 100,000 (typical) —
Embedded RAM Bits 49,152 bits —
Maximum User I/Os 191 —
Logic Array Blocks (LABs) 624 —
Maximum Internal Frequency 200 MHz —
Propagation Delay 0.6 ns —
Process Technology 0.22 micron CMOS 0.22 µm CMOS SRAM
Core Supply Voltage 2.5 V 2.5 V (range 2.3 V to 2.7 V)
I/O Supply Voltage 3.3 V —
Logic Family CMOS —
Packhaging 256-ball FBGA (FineLine BGA) 256-pin FineLine BGA (FBGA)
Temperature na Operasyon 0C to +70C (commercial) —
Speed Grade -3 (faster) -3
JTAG Support IEEE 1149.1-1990 compliant —
PCI Compliance PCI Local Bus Specification Rev 2.2 at 33/66 MHz PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade)
Typical Gates — 100,000
Logic Elements (LEs) — 4,992
Embedded Array Blocks (EABs) — 12
Total RAM Bits — 24,576
Maximum Operating Frequency — 200 MHz
User I/O Pins (max) — [DATA_NEEDED: exact user I/O count for BFC256 package]
Hanay ng Temperature na Operasyon — 0 °C to 70 °C
Configuration Method — SRAM, requires external config device
JTAG Boundary Scan — IEEE Std. 1149.1-1990 compliant
Uri ng Pagpapasok — Surface Mount (BGA)
Level ng MSL — [DATA_NEEDED: MSL rating]
Tindminan RoHS — [DATA_NEEDED: RoHS status]

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