EPF10K130EBC600-2 vs EPF10K200EBC600-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EBC600-2 sa pamamagitan ng Altera at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K130EBC600-2 EPF10K200EBC600-2
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family FLEX-10KE —
Typical Gates 130,000 —
Logic Array Blocks (LABs) 832 1248
User I/Os 424 —
Embedded Memory (EAB) 4 kbit per EAB 98304 bits (96 Kbits)
Core Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V nominal) —
I/O Voltage (VCCIO) MultiVolt: 1.8 V / 2.5 V / 3.3 V —
Process Technology SRAM CMOS, 0.25 um 0.30 µm CMOS
Speed Grade -2 —
Pin-to-Pin Delay 0.5 ns —
Packhaging 600-BGA (45 x 45 mm) —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon 0 C to +70 C (Commercial) 0°C to +70°C (Commercial)
Configuration Method Serial / Parallel / JTAG JTAG (IEEE 1149.1), EPC2 serial PROM
Tindminan RoHS Compliant unknown
Level ng MSL 3 (168 hours) —
Supply Current (Quiescent) 10 mA typical —
Series — FLEX-10KE
Logic Family — CMOS (SRAM-based)
Typical Gate Count — 200,000 gates
Logic Elements (LEs) — 9984
Maximum User I/O — 470 pins
Propagation Delay — 0.4 ns
Volte ng Pagbibigay — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Part Status — Obsolete

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