EPF10K130EFC484-3 vs EPF10K130EFC484-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC484-3 sa pamamagitan ng Intel at EPF10K130EFC484-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K130EFC484-3 EPF10K130EFC484-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Presyo ng Yunit (USD) — $92.00
Family FLEX 10KE FLEX-10KE
Logic Elements (LEs) 6,656 —
Typical Gate Count 130,000 system gates —
Logic Array Blocks (LABs) 832 832
Embedded Memory (EABs) 16 x 4,096 bits (65,536 bits total) —
Maximum User I/O 369 —
Supply Voltage (Core) 3.3 V —
I/O Voltage Support 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) —
Propagation Delay 0.6 ns (per LE) 0.6 ns
Speed Grade -3 -1 (slower commercial bin)
Temperature na Operasyon 0 C to +70 C (commercial) 0C to +70C (Commercial)
Packhaging 484-pin FBGA (FineLine BGA) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Configuration Method SRAM-based, serial or parallel, requires external configuration device —
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Logic Family CMOS (SRAM-based) CMOS
Series — FLEX-10KE
Typical Gates — 130,000
Logic Elements — 6,656
Embedded Memory (EAB) — 65,536 bits (64 Kbit)
User I/Os — 369
Maximum Frequency — 333.33 MHz
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 3.3 V (MultiVolt I/O compatible with 5.0 V tolerant)
Package Type — FineLine BGA-484
Package Dimensions — 23 x 23 mm
Ball Pitch — 1.0 mm
Configuration Interface — JTAG (IEEE 1149.1 / IEEE 1532)

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