EPF10K130EFC484-3N vs EPF10K100EFC484-3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC484-3N sa pamamagitan ng Intel at EPF10K100EFC484-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K130EFC484-3N EPF10K100EFC484-3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 —
Typical Gate Count 130000 —
Number of I/O 369 —
Number of LABs/CLBs 832 —
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) -3 (fastest commercial bin)
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Configuration Memory SRAM-based (volatile, requires config device) —
Tindminan RoHS [DATA_NEEDED: RoHS status] —
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX 10KE
Logic Elements / Cells — 4992
Total Gates — 100,000
Embedded Memory (EAB) — 49,152 bits (12 EABs)
Logic Array Blocks (LABs) — 624
User I/Os — 338
Core Voltage (VCCINT) — 2.5 V
I/O Voltage (VCCIO) — MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank)
Internal Performance — 200 MHz
Packhaging — 484-ball FineLine BGA (FC484 / FBGA-484)
Temperature Grade — Commercial (0 °C to +70 °C)
Configuration Method — SRAM (external EPROM/Flash/JTAG required at power-up)
Lead-Free / RoHS — Yes (N suffix = lead-free)

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