EPF10K130EFC672-2X vs EPF10K130EFC672-1X Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC672-2X sa pamamagitan ng Intel at EPF10K130EFC672-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K130EFC672-2X EPF10K130EFC672-1X
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series FLEX 10KE FLEX 10KE®
Number of Logic Elements (LEs) 6656 —
Number of Logic Array Blocks (LABs) 832 —
Total RAM Bits 65536 65,536
Number of User I/Os 413 —
Number of DLLs 4 —
Packhaging 672-FBGA (FineLine BGA, 27x27 mm) 672-ball FBGA, 27x27 mm, 1.0 mm pitch
Ball Pitch 1.0 mm —
Core Supply Voltage 2.5 V (2.375 V to 2.625 V) —
I/O Supply Voltage 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) —
Temperature na Operasyon 0C to +70C (commercial) —
Process Technology 0.22 μm CMOS SRAM 0.22 µm CMOS, SRAM-based
Configuration Method Serial configuration device, JTAG —
Logic Family CMOS, SRAM-based —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Family — FLEX 10KE
Typical Gates — 130,000
Logic Elements (LEs) — 6,656
Logic Array Blocks (LABs) — 832
User I/Os — 413
Number of I/O Banks — 8
Core Voltage — 2.5 V (2.375 V to 2.625 V)
Internal Operating Frequency — up to 333.33 MHz
Speed Grade — -1X
Operating Temperature (Commercial) — 0 °C to +70 °C
Configuration Mode — Passive Serial, JTAG, ByteBlaster
Moisture Sensitivity Level — MSL 3 (per JEDEC J-STD-020)
Lead-Free — [DATA_NEEDED: lead-free status]

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