EPF10K130EFC672-2X vs EPF10K130EFC672-1X 比較
詳細並排比較 EPF10K130EFC672-2X 由 Intel 與 EPF10K130EFC672-1X 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPF10K130EFC672-2X | EPF10K130EFC672-1X |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | FLEX 10KE | FLEX 10KE® |
| Number of Logic Elements (LEs) | 6656 | — |
| Number of Logic Array Blocks (LABs) | 832 | — |
| Total RAM Bits | 65536 | 65,536 |
| Number of User I/Os | 413 | — |
| Number of DLLs | 4 | — |
| 封裝 | 672-FBGA (FineLine BGA, 27x27 mm) | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) | — |
| 工作溫度 | 0C to +70C (commercial) | — |
| Process Technology | 0.22 μm CMOS SRAM | 0.22 µm CMOS, SRAM-based |
| Configuration Method | Serial configuration device, JTAG | — |
| Logic Family | CMOS, SRAM-based | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Family | — | FLEX 10KE |
| Typical Gates | — | 130,000 |
| Logic Elements (LEs) | — | 6,656 |
| Logic Array Blocks (LABs) | — | 832 |
| User I/Os | — | 413 |
| Number of I/O Banks | — | 8 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Internal Operating Frequency | — | up to 333.33 MHz |
| Speed Grade | — | -1X |
| Operating Temperature (Commercial) | — | 0 °C to +70 °C |
| Configuration Mode | — | Passive Serial, JTAG, ByteBlaster |
| Moisture Sensitivity Level | — | MSL 3 (per JEDEC J-STD-020) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |